Tuesday, October 5, 2010

DARPAs Ultraperformance Nanophotonic Intrachip Communitcations (UNIC)

UNIC is a DARPA-funded project that started in 2008 and is slated to run for about five years. Sun/Oracle, Kotura and Luxtera are working to develop this chip-to-chip "high-performance, CMOS-compatible photonic technology for high-throughput, non-blocking and power-efficient intrachip photonic communications networks."


The first application of such technology is targeted for optical interconnects for microprocessors. The goal is to replace high-performance computing clusters with computers that consist of these arrays of microprocessors interconnected by optics. Another goal of the project is to make sure the new devices are "compatible" with CMOS processes in order to also integrate the associated electronic devices. Using its now proven Silicon CMOS Photonics technology, Luxtera has developed transmitters and receivers for the project. Kotura supported the project with new low-power, high-speed modulators made of silicon photonics.


Potential new products are expected by the end of 2012. While these will be initial products, commercialization is not expected until quite some time later, perhaps not until 2016 or so. Meanwhile, Luxtera will continue to use its technology to sell 10, 40 and 100G transceivers and AOCs.


With data rates increasing beyond 10G, chip-to-chip, on-board and board-to-board optical interconnects will become progressively more significant. Even at 10G, traditional printed-circuit boards cannot support transmission beyond about 12 inches without needing re-timers. As I’ve mentioned in previous posts, instead of spending money to develop more exotic PCBs using complicated digital signal processing (DSP), it may be time to embrace optical interconnects for both board-level and chip-level.

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